See on Scoop.it – Tracking the Future
The International Technology Roadmap for Semiconductors (ITRS) predicts that by 2015, copper-based vias that connect the silicon surface to a chips’ wiring and connect one layer of wiring to another simply will not be able to do the job anymore. That day is a little over a year away—practically tomorrow in technological innovation terms. As a result, there is a bit of a scramble to find alternatives—not just for vias but for all sorts of interconnects used in integrated circuits (ICs).
Researchers at the University of California, Santa Barbara (UCSB) have taken an initial step in offering one possible alternative: “an integrated circuit design scheme in which transistors and interconnects are monolithically patterned seamlessly on a sheet of graphene.”
See on spectrum.ieee.org
trackingthefuture 
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