The future of computers: 3D chip stacking

Via Scoop.itTracking the Future

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D “tri-gate” FinFET transistors. These CPUs will be incredibly fast and use very little power, but ultimately they are just another last-gasp effort to squeeze a little more life out of a material and process that will soon hit a wall. Computing is still predominantly single-threaded; throwing more transistors and more cores at a problem will only take you so far. Fortunately, there’s another maturing technology that should provide a much-needed lease of life to the silicon industry: Chip stacking, or to give its formal name, 3D wafer-level chip packaging. 

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